935290454112
vs
PGR5226
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ERICSSON POWER MODULES AB
|
| Package Description |
SOP,
|
50 X 30 X 9 MM, MODULE
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G8
|
R-XXFO-X
|
| JESD-609 Code |
e4
|
|
| Length |
4.9 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
24
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
XFO
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FIBER OPTIC
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Telecom IC Type |
SUPPORT CIRCUIT
|
SUPPORT CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
UNSPECIFIED
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
UNSPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
MODULE
|
| Pin Count |
|
24
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare 935290454112 with alternatives
Compare PGR5226 with alternatives