935276426118
vs
PCA9555PW,112
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
TSSOP,
TSSOP-24
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
0.4 MHz
0.4 MHz
External Data Bus Width
JESD-30 Code
R-PDSO-G24
R-PDSO-G24
Length
7.8 mm
7.8 mm
Number of I/O Lines
16
16
Number of Ports
2
2
Number of Terminals
24
24
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.3 V
2.3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
4.4 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
1
Rohs Code
Part Package Code
TSSOP2
Pin Count
24
Manufacturer Package Code
SOT355-1
Factory Lead Time
16 Weeks
Samacsys Manufacturer
NXP
JESD-609 Code
e4
Moisture Sensitivity Level
1
Number of Bits
16
Package Equivalence Code
TSSOP24,.25
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
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