935276426118
vs
PCA9555PW
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Package Description
TSSOP,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
0.4 MHz
External Data Bus Width
JESD-30 Code
R-PDSO-G24
R-PDSO-G24
Length
7.8 mm
7.8 mm
Number of I/O Lines
16
Number of Ports
2
Number of Terminals
24
24
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max
5.5 V
Supply Voltage-Min
2.3 V
Supply Voltage-Nom
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
4.4 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
4
Rohs Code
JESD-609 Code
e4
Number of Bits
16
Package Equivalence Code
TSSOP24,.25
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Terminal Finish
NICKEL PALLADIUM GOLD
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