935275672118 vs MCP23009-E/MG feature comparison

935275672118 NXP Semiconductors

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MCP23009-E/MG Microchip Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS MICROCHIP TECHNOLOGY INC
Part Package Code SSOP QFN
Package Description LSSOP, QFN-16
Pin Count 20 16
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 0.1 MHz 10 MHz
External Data Bus Width
JESD-30 Code R-PDSO-G20 S-PQCC-N16
JESD-609 Code e4 e3
Length 6.5 mm 3 mm
Moisture Sensitivity Level 1 1
Number of I/O Lines 8 8
Number of Ports 1 8
Number of Terminals 20 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP HVQCCN
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 0.9 mm
Supply Voltage-Max 6 V 5.5 V
Supply Voltage-Min 2.5 V 1.8 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD MATTE TIN
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 40
Width 4.4 mm 3 mm
uPs/uCs/Peripheral ICs Type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches 1 1
Factory Lead Time 12 Weeks
Samacsys Manufacturer Microchip
Number of Bits 8
Package Equivalence Code LCC16,.12SQ,20
Supply Current-Max 1 mA

Compare 935275672118 with alternatives

Compare MCP23009-E/MG with alternatives