935275672118
vs
MCP23S08T-E/MF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
MICROCHIP TECHNOLOGY INC
Part Package Code
SSOP
QFN
Package Description
LSSOP,
QFN-20
Pin Count
20
20
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
0.1 MHz
10 MHz
External Data Bus Width
JESD-30 Code
R-PDSO-G20
S-PQCC-N20
JESD-609 Code
e4
e3
Length
6.5 mm
4 mm
Moisture Sensitivity Level
1
1
Number of I/O Lines
8
8
Number of Ports
1
1
Number of Terminals
20
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
HVQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1 mm
Supply Voltage-Max
6 V
5.5 V
Supply Voltage-Min
2.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Matte Tin (Sn)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
40
Width
4.4 mm
4 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
1
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Compare MCP23S08T-E/MF with alternatives