935274721125
vs
74HC2G125DP,125
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
VSSOP,
3 MM, PLASTIC, SOT-505-2, TSSOP-8
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G8
S-PDSO-G8
JESD-609 Code
e4
e4
Length
2.3 mm
3 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
1
1
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
TSSOP
Package Equivalence Code
TSSOP8,.12,20
TSSOP8,.16
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
135 ns
135 ns
Seated Height-Max
1 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
2 mm
3 mm
Base Number Matches
1
1
Rohs Code
Yes
Part Package Code
TSSOP
Pin Count
8
Manufacturer Package Code
SOT505-2
Factory Lead Time
4 Weeks
Control Type
ENABLE LOW
Max I(ol)
0.006 A
Moisture Sensitivity Level
1
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
27 ns
Qualification Status
Not Qualified
Time@Peak Reflow Temperature-Max (s)
30
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