935274721125 vs 74HC2G125DP,125 feature comparison

935274721125 NXP Semiconductors

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74HC2G125DP,125 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description VSSOP, 3 MM, PLASTIC, SOT-505-2, TSSOP-8
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G8 S-PDSO-G8
JESD-609 Code e4 e4
Length 2.3 mm 3 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 1 1
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP TSSOP
Package Equivalence Code TSSOP8,.12,20 TSSOP8,.16
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 135 ns 135 ns
Seated Height-Max 1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Width 2 mm 3 mm
Base Number Matches 1 1
Rohs Code Yes
Part Package Code TSSOP
Pin Count 8
Manufacturer Package Code SOT505-2
Factory Lead Time 4 Weeks
Control Type ENABLE LOW
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) 30

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Compare 74HC2G125DP,125 with alternatives