935271937157
vs
UT54ACS164646S-UCA
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
AEROFLEX MICROELECTRONIC SOLUTIONS
|
| Part Package Code |
BGA
|
|
| Package Description |
VFBGA,
|
,
|
| Pin Count |
56
|
|
| Manufacturer Package Code |
SOT702-1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
|
| JESD-30 Code |
R-PBGA-B56
|
|
| Length |
7 mm
|
|
| Logic IC Type |
BUS DRIVER
|
|
| Number of Bits |
4
|
|
| Number of Functions |
4
|
|
| Number of Ports |
2
|
|
| Number of Terminals |
56
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
VFBGA
|
|
| Package Equivalence Code |
BGA56,6X10,25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
6 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4.5 mm
|
|
| Base Number Matches |
2
|
3
|
|
|
|
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