935271937157
vs
HD74ALVC16834
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
RENESAS TECHNOLOGY CORP
|
| Part Package Code |
BGA
|
SSOP
|
| Package Description |
VFBGA,
|
TSSOP,
|
| Pin Count |
56
|
56
|
| Manufacturer Package Code |
SOT702-1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
ALVC
|
| JESD-30 Code |
R-PBGA-B56
|
R-PDSO-G56
|
| Length |
7 mm
|
14 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Number of Bits |
4
|
18
|
| Number of Functions |
4
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
56
|
56
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
TSSOP
|
| Package Equivalence Code |
BGA56,6X10,25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
6 ns
|
5.8 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4.5 mm
|
6.1 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare 935271937157 with alternatives
Compare HD74ALVC16834 with alternatives