935261296518 vs SC16C654IB64,157 feature comparison

935261296518 NXP Semiconductors

Buy Now Datasheet

SC16C654IB64,157 NXP Semiconductors

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code LCC QFP
Package Description QCCJ, LFQFP, QFP64,.47SQ,20
Pin Count 68 64
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 3.3V SUPPLY AT 20 MHZ ALSO OPERATES AT 2.5V SUPPLY
Address Bus Width 7 5
Boundary Scan NO NO
Clock Frequency-Max 33 MHz 80 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Encoding/Decoding Method NRZ
Data Transfer Rate-Max 0.125 MBps 0.625 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J68 S-PQFP-G64
JESD-609 Code e3 e3
Length 24.23 mm 10 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 1
Number of Serial I/Os 4 4
Number of Terminals 68 64
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LFQFP
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 1.6 mm
Supply Voltage-Max 5.5 V 3.63 V
Supply Voltage-Min 4.5 V 2.97 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 24.23 mm 10 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1
Package Equivalence Code QFP64,.47SQ,20

Compare 935261296518 with alternatives

Compare SC16C654IB64,157 with alternatives