935238750118 vs MC74LCX16373DT feature comparison

935238750118 NXP Semiconductors

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MC74LCX16373DT Motorola Mobility LLC

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code TSSOP TSSOP
Package Description TSSOP, TSSOP,
Pin Count 48 48
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e4 e0
Length 12.5 mm 12.5 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1
Number of Bits 1 8
Number of Functions 16 2
Number of Ports 2 2
Number of Terminals 48 48
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE WITH SERIES RESISTOR 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 6.8 ns 6.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 2 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 6.1 mm 6.1 mm
Base Number Matches 1 2
Load Capacitance (CL) 50 pF

Compare 935238750118 with alternatives

Compare MC74LCX16373DT with alternatives