935187520112
vs
935009150112
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NEXPERIA
NXP SEMICONDUCTORS
Package Description
SSOP,
DIP,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
RIGHT
RIGHT
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e4
e4
Length
6.2 mm
21.6 mm
Logic IC Type
SERIAL IN PARALLEL OUT
SERIAL IN PARALLEL OUT
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
IN-LINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Propagation Delay (tpd)
295 ns
240 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
4.7 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.3 mm
7.62 mm
fmax-Min
24 MHz
24 MHz
Base Number Matches
2
1
Pbfree Code
Part Package Code
DIP
Pin Count
16
Compare 935187520112 with alternatives
Compare 935009150112 with alternatives