935009150112 vs 935187520118 feature comparison

935009150112 NXP Semiconductors

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935187520118 Nexperia

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code DIP
Package Description DIP, SSOP,
Pin Count 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction RIGHT RIGHT
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T16 R-PDSO-G16
JESD-609 Code e4 e4
Length 21.6 mm 6.2 mm
Logic IC Type SERIAL IN PARALLEL OUT SERIAL IN PARALLEL OUT
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 240 ns 295 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.7 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 5.3 mm
fmax-Min 24 MHz 24 MHz
Base Number Matches 1 2
Moisture Sensitivity Level 1

Compare 935009150112 with alternatives

Compare 935187520118 with alternatives