934060065112
vs
BLF6G20-45,112
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
FLANGE MOUNT, R-CDFM-F2
ROHS COMPLIANT, CERAMIC PACKAGE-2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Case Connection
SOURCE
SOURCE
Configuration
SINGLE
SINGLE
DS Breakdown Voltage-Min
65 V
65 V
Drain Current-Max (ID)
13 A
13 A
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
L BAND
L BAND
JESD-30 Code
R-CDFM-F2
R-CDFM-F2
Number of Elements
1
1
Number of Terminals
2
2
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLANGE MOUNT
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Surface Mount
YES
YES
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
1
Rohs Code
Yes
Part Package Code
DFM
Pin Count
2
Manufacturer Package Code
SOT608A
HTS Code
8541.29.00.75
Operating Temperature-Max
225 °C
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 934060065112 with alternatives
Compare BLF6G20-45,112 with alternatives
BLF6G20-45,112 vs BLF6G20-45,135
BLF6G20-45,112 vs 934060065135
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BLF6G20-45,112 vs BLF6G20-110,112
BLF6G20-45,112 vs 934060896112
BLF6G20-45,112 vs BLF6G20LS-110,112
BLF6G20-45,112 vs 934064344112
BLF6G20-45,112 vs BLF6G20LS-110,118
BLF6G20-45,112 vs BLF6G20-75