934024350115
vs
BC860BW,115
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SC-70
SC-70
Package Description
PLASTIC, SC-70, 3 PIN
PLASTIC, UMT3, SMD, SC-70, CMPAK-3
Pin Count
3
3
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Additional Feature
LOW NOISE
LOW NOISE
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Emitter Voltage-Max
45 V
45 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
420
220
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
3
3
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Polarity/Channel Type
PNP
PNP
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
Tin (Sn)
TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
100 MHz
100 MHz
Base Number Matches
2
2
Manufacturer Package Code
SOT323
HTS Code
8541.21.00.95
Factory Lead Time
4 Weeks
Collector-Base Capacitance-Max
5 pF
Operating Temperature-Max
150 °C
Power Dissipation-Max (Abs)
0.2 W
VCEsat-Max
0.65 V
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