933825200005
vs
GD54HCT366J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
LG SEMICON CO LTD
Part Package Code
DIE
Package Description
,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
JESD-30 Code
X-XUUC-N
R-XDIP-T16
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
1
6
Number of Functions
6
1
Number of Ports
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
UNSPECIFIED
CERAMIC
Package Equivalence Code
DIE OR CHIP
DIP16,.3
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Propagation Delay (tpd)
36 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Base Number Matches
1
2
Rohs Code
No
Control Type
ENABLE LOW
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.006 A
Number of Terminals
16
Package Code
DIP
Prop. Delay@Nom-Sup
46 ns
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
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