933715660653 vs MC14067BCPD feature comparison

933715660653 NXP Semiconductors

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MC14067BCPD Motorola Mobility LLC

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SOIC DIP
Package Description PLASTIC, SO-24 DIP, DIP24,.6
Pin Count 24 24
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER
JESD-30 Code R-PDSO-G24 R-PDIP-T24
JESD-609 Code e4 e0
Length 15.4 mm 31.75 mm
Moisture Sensitivity Level 1
Number of Channels 16 16
Number of Functions 1 1
Number of Terminals 24 24
Off-state Isolation-Nom 50 dB 40 dB
On-state Resistance Match-Nom 9 Ω 10 Ω
On-state Resistance-Max (Ron) 180 Ω 280 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 5.08 mm
Supply Voltage-Max (Vsup) 10 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V 15 V
Surface Mount YES NO
Switch-off Time-Max 60 ns 190 ns
Switch-on Time-Max 50 ns 190 ns
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.5 mm 15.24 mm
Base Number Matches 2 3
Neg Supply Voltage-Nom (Vsup)
Package Equivalence Code DIP24,.6
Supply Current-Max (Isup) 0.6 mA

Compare 933715660653 with alternatives

Compare MC14067BCPD with alternatives