933624760113
vs
BAT85,133
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
End Of Life
|
Transferred
|
Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
HERMETIC SEALED, GLASS PACKAGE-2
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.70
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JEDEC-95 Code |
DO-34
|
DO-34
|
JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Output Current-Max |
0.2 A
|
0.2 A
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
IEC-60134
|
CECC50001-059
|
Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
Surface Mount |
NO
|
NO
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Finish |
TIN
|
TIN
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
DO-34
|
Pin Count |
|
2
|
Manufacturer Package Code |
|
SOD68
|
Factory Lead Time |
|
4 Weeks
|
Forward Voltage-Max (VF) |
|
0.8 V
|
Non-rep Pk Forward Current-Max |
|
0.6 A
|
Rep Pk Reverse Voltage-Max |
|
30 V
|
Reverse Current-Max |
|
2 µA
|
|
|
|
Compare 933624760113 with alternatives
Compare BAT85,133 with alternatives