8SLVD2104NBGI
vs
SY58033UMGTR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
VFQFPN
DFN
Package Description
5 X 5 MM, 0.50 MM PITCH, ROHS COMPLIANT, VFQFN-28
HVQCCN,
Pin Count
28
32
Manufacturer Package Code
NBG28
MLF
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
8SLVD
58033
Input Conditioning
DIFFERENTIAL
DIFFERENTIAL
JESD-30 Code
S-XQCC-N28
S-XQCC-N32
JESD-609 Code
e3
e4
Length
5 mm
5 mm
Logic IC Type
LOW SKEW CLOCK DRIVER
LOW SKEW CLOCK DRIVER
Moisture Sensitivity Level
1
2
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
28
32
Number of True Outputs
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVQCCN
HVQCCN
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
0.3 ns
0.28 ns
Same Edge Skew-Max (tskwd)
0.04 ns
0.02 ns
Seated Height-Max
0.8 mm
0.9 mm
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
5 mm
5 mm
Base Number Matches
3
2
Additional Feature
CAN ALSO OPERATE WITH 3.3V SUPPLY
Package Equivalence Code
LCC32,.2SQ,20
Packing Method
TR
Qualification Status
Not Qualified
Time@Peak Reflow Temperature-Max (s)
40
fmax-Min
5500 MHz
Compare 8SLVD2104NBGI with alternatives
Compare SY58033UMGTR with alternatives