8S89834AKILF
vs
SY89874UMG
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
VFQFPN
|
|
| Package Description |
3 X 3 MM, 0.925 MM HEIGHT, ROHS COMPLIANT, MO-220VEED-2, VFQFN-16
|
MLF-16
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
NLG16P2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATES WITH 2.97V TO 3.63V SUPPLY
|
CAN ALSO OPERATE WITH 3.3V SUPPLY
|
| Family |
S
|
89874
|
| Input Conditioning |
DIFFERENTIAL MUX
|
DIFFERENTIAL
|
| JESD-30 Code |
S-XQCC-N16
|
S-XQCC-N16
|
| JESD-609 Code |
e3
|
e4
|
| Length |
3 mm
|
3 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Moisture Sensitivity Level |
3
|
2
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
16
|
16
|
| Number of True Outputs |
4
|
2
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC16,.12SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
0.55 ns
|
|
| Propagation Delay (tpd) |
0.55 ns
|
0.79 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.03 ns
|
0.015 ns
|
| Seated Height-Max |
1 mm
|
0.95 mm
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3 mm
|
3 mm
|
| fmax-Min |
1000 MHz
|
2500 MHz
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
7 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Packing Method |
|
TUBE
|
|
|
|
Compare 8S89834AKILF with alternatives
Compare SY89874UMG with alternatives