SY89874UMG
vs
8SLVP1102ANLGI/W
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
RENESAS ELECTRONICS CORP
|
| Package Description |
MLF-16
|
HQCCN, LCC16,.12SQ,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
7 Weeks
|
26 Weeks, 1 Day
|
| Samacsys Manufacturer |
Microchip
|
Renesas Electronics
|
| Additional Feature |
CAN ALSO OPERATE WITH 3.3V SUPPLY
|
ALSO OPERATES AT 3.3 V SUPPLY
|
| Family |
89874
|
8SLVP
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
S-XQCC-N16
|
S-PQCC-N16
|
| JESD-609 Code |
e4
|
e3
|
| Length |
3 mm
|
3 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Moisture Sensitivity Level |
2
|
3
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
16
|
16
|
| Number of True Outputs |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TUBE
|
TR
|
| Propagation Delay (tpd) |
0.79 ns
|
0.25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.015 ns
|
0.015 ns
|
| Seated Height-Max |
0.95 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
3 mm
|
3 mm
|
| fmax-Min |
2500 MHz
|
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
VFQFPN
|
| Pin Count |
|
16
|
| Manufacturer Package Code |
|
NLG16P2
|
| ECCN Code |
|
EAR99
|
| Package Equivalence Code |
|
LCC16,.12SQ,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supply Current-Max (ICC) |
|
106 mA
|
|
|
|
Compare SY89874UMG with alternatives
Compare 8SLVP1102ANLGI/W with alternatives