89HPES5T5ZBBCI
vs
89HPES5T5ZBBCG
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
CABGA
|
CABGA
|
Package Description |
CABGA-196
|
CABGA-196
|
Pin Count |
196
|
196
|
Manufacturer Package Code |
BC196
|
BCG196
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
EAR99
|
HTS Code |
8542.31.00.01
|
8542.39.00.01
|
Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
ALSO REQUIRES 3.3V SUPPLY
|
Address Bus Width |
|
|
Bus Compatibility |
PCI
|
PCI
|
Clock Frequency-Max |
125 MHz
|
125 MHz
|
Data Transfer Rate-Max |
2500 MBps
|
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
JESD-609 Code |
e0
|
e1
|
Length |
15 mm
|
15 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
196
|
196
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA196,14X14,40
|
BGA196,14X14,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
225
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
1.5 mm
|
Supply Voltage-Max |
1.1 V
|
1.1 V
|
Supply Voltage-Min |
0.9 V
|
0.9 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
30
|
Width |
15 mm
|
15 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
Base Number Matches |
2
|
4
|
|
|
|
Compare 89HPES5T5ZBBCI with alternatives
Compare 89HPES5T5ZBBCG with alternatives