89HPES4T4ZBBCI
vs
89HPES4T4ZBNQG
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
CABGA
|
VFQFPN
|
| Package Description |
CABGA-144
|
QFN-132
|
| Pin Count |
144
|
132
|
| Manufacturer Package Code |
BC144
|
NQG132
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Address Bus Width |
|
|
| Bus Compatibility |
PCI
|
PCI
|
| Clock Frequency-Max |
125 MHz
|
125 MHz
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PBGA-B144
|
S-XQCC-N132
|
| JESD-609 Code |
e0
|
e3
|
| Length |
13 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
144
|
132
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
LBGA
|
HVQCCN
|
| Package Equivalence Code |
BGA144,12X12,40
|
LGA132,20X20,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
225
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.5 mm
|
0.9 mm
|
| Supply Voltage-Max |
1.1 V
|
1.1 V
|
| Supply Voltage-Min |
0.9 V
|
0.9 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
1 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
13 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare 89HPES4T4ZBBCI with alternatives
Compare 89HPES4T4ZBNQG with alternatives