89HPES4T4ZBNQG
vs
89HPES4T4ZBNQ
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
VFQFPN
|
QFN
|
| Package Description |
QFN-132
|
HVQCCN, LGA132,20X20,20
|
| Pin Count |
132
|
132
|
| Manufacturer Package Code |
NQG132
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
3A991.A.2
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
|
| Bus Compatibility |
PCI
|
PCI
|
| Clock Frequency-Max |
125 MHz
|
125 MHz
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-XQCC-N132
|
S-XQCC-N132
|
| JESD-609 Code |
e3
|
e0
|
| Length |
10 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
132
|
132
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LGA132,20X20,20
|
LGA132,20X20,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Voltage-Max |
1.1 V
|
1.1 V
|
| Supply Voltage-Min |
0.9 V
|
0.9 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 89HPES4T4ZBNQG with alternatives
Compare 89HPES4T4ZBNQ with alternatives