89HPES24T3G2ZBBLG
vs
89HPES24T3G2ZCALIG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
FCBGA
BGA
Package Description
27 X 27 MM, 1 MM PITCH, GREEN, FCBGA-676
BGA,
Pin Count
676
324
Manufacturer Package Code
BLG676
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
Bus Compatibility
PCI
PCI
Clock Frequency-Max
125 MHz
125 MHz
External Data Bus Width
JESD-30 Code
S-PBGA-B676
S-PBGA-B324
JESD-609 Code
e1
e3
Length
27 mm
19 mm
Moisture Sensitivity Level
4
Number of Terminals
676
324
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA676,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.22 mm
3.42 mm
Supply Voltage-Max
1.1 V
1.1 V
Supply Voltage-Min
0.9 V
0.9 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
MATTE TIN
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
19 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
BUS CONTROLLER, PCI
Base Number Matches
1
1
Compare 89HPES24T3G2ZBBLG with alternatives
Compare 89HPES24T3G2ZCALIG with alternatives