89HPES24T3G2ZCALIG
vs
89HPES24T3G2ZCALG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
FCBGA
Package Description
BGA,
FCBGA-324
Pin Count
324
324
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
EAR99
HTS Code
8542.31.00.01
8542.39.00.01
Address Bus Width
Bus Compatibility
PCI
PCI
Clock Frequency-Max
125 MHz
125 MHz
External Data Bus Width
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e3
e1
Length
19 mm
19 mm
Number of Terminals
324
324
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.42 mm
3.42 mm
Supply Voltage-Max
1.1 V
1.1 V
Supply Voltage-Min
0.9 V
0.9 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
19 mm
19 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
BUS CONTROLLER, PCI
Base Number Matches
1
2
Manufacturer Package Code
ALG324
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Moisture Sensitivity Level
4
Package Equivalence Code
BGA324,18X18,40
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare 89HPES24T3G2ZCALIG with alternatives
Compare 89HPES24T3G2ZCALG with alternatives