89HPES24T3G2ZAAR
vs
89HPES24T3G2ZCALIG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
BGA,
BGA,
Pin Count
324
324
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
Clock Frequency-Max
125 MHz
125 MHz
Drive Interface Standard
IEEE 1149.1
External Data Bus Width
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e3
e3
Length
19 mm
19 mm
Number of Terminals
324
324
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.42 mm
3.42 mm
Supply Voltage-Max
1.1 V
1.1 V
Supply Voltage-Min
0.9 V
0.9 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
19 mm
19 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
BUS CONTROLLER, PCI
Base Number Matches
1
1
Bus Compatibility
PCI
Compare 89HPES24T3G2ZAAR with alternatives
Compare 89HPES24T3G2ZCALIG with alternatives