89HPES24T3G2ZAAR
vs
89HPES24T3G2ZCAL8
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
No
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
FCBGA
Package Description
BGA,
FCBGA-324
Pin Count
324
324
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY.
Address Bus Width
Clock Frequency-Max
125 MHz
125 MHz
Drive Interface Standard
IEEE 1149.1
External Data Bus Width
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e3
e0
Length
19 mm
19 mm
Number of Terminals
324
324
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Seated Height-Max
3.42 mm
3.42 mm
Supply Voltage-Max
1.1 V
1.1 V
Supply Voltage-Min
0.9 V
0.9 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
20
Width
19 mm
19 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
BUS CONTROLLER, PCI
Base Number Matches
2
1
Manufacturer Package Code
AL324
Bus Compatibility
SMBUS
Data Transfer Rate-Max
625 MBps
Moisture Sensitivity Level
4
Compare 89HPES24T3G2ZAAR with alternatives
Compare 89HPES24T3G2ZCAL8 with alternatives