89HPES16T4AG2ZBALG
vs
89HPES16T4AG2ZAAL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
FCBGA
BGA
Package Description
FCBGA-324
19 X 19 MM, 1 MM PITCH, FCBGA-324
Pin Count
324
324
Manufacturer Package Code
ALG324
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Bus Compatibility
PCI; SMBUS
PCI; SMBUS
Clock Frequency-Max
100 MHz
100 MHz
Data Transfer Rate-Max
16000 MBps
16000 MBps
External Data Bus Width
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e1
e0
Length
19 mm
19 mm
Moisture Sensitivity Level
4
Number of Terminals
324
324
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA324,18X18,40
BGA324,18X18,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.42 mm
3.42 mm
Supply Voltage-Max
1.1 V
1.1 V
Supply Voltage-Min
0.9 V
0.9 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
19 mm
19 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
BUS CONTROLLER, PCI
Base Number Matches
1
1
Compare 89HPES16T4AG2ZBALG with alternatives
Compare 89HPES16T4AG2ZAAL with alternatives