89HPES16T4AG2ZAAL
vs
89HPES16T4AG2ZCALGI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
19 X 19 MM, 1 MM PITCH, FCBGA-324
BGA, BGA324,18X18,40
Pin Count
324
324
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Bus Compatibility
PCI; SMBUS
PCI; SMBUS
Clock Frequency-Max
100 MHz
100 MHz
Data Transfer Rate-Max
16000 MBps
16000 MBps
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e0
e1
Length
19 mm
19 mm
Number of Terminals
324
324
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA324,18X18,40
BGA324,18X18,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.42 mm
3.42 mm
Supply Voltage-Max
1.1 V
1.1 V
Supply Voltage-Min
0.9 V
0.9 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
19 mm
19 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
BUS CONTROLLER, PCI
Base Number Matches
1
1
Moisture Sensitivity Level
4
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare 89HPES16T4AG2ZAAL with alternatives
Compare 89HPES16T4AG2ZCALGI with alternatives