89H24NT24G2ZBHLG8
vs
89H24NT24G2ZBHLI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
FCBGA
FCBGA
Package Description
FCBGA-324
FCBGA-324
Pin Count
324
324
Manufacturer Package Code
HLG324
HL324
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
3A991.A.2
HTS Code
8542.39.00.01
8542.31.00.01
Address Bus Width
Bus Compatibility
I2C; ISA; PCI; SMBUS; VGA
I2C; ISA; VGA
Clock Frequency-Max
125 MHz
125 MHz
Data Transfer Rate-Max
24000 MBps
24000 MBps
External Data Bus Width
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e1
e0
Length
19 mm
19 mm
Moisture Sensitivity Level
4
4
Number of Terminals
324
324
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
225
Seated Height-Max
2.88 mm
2.88 mm
Supply Voltage-Max
1.1 V
1.1 V
Supply Voltage-Min
0.9 V
0.9 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
19 mm
19 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
BUS CONTROLLER, PCI
Base Number Matches
1
2
Additional Feature
ALSO OPERATES AT 100 MHZ
Drive Interface Standard
IEEE 1149.6AC; IEEE 1149.1
Package Equivalence Code
BGA324,18X18,40
Qualification Status
Not Qualified
Supply Current-Max
3400 mA
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