8959826BXC
vs
TC55V2001TR-10L
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
AUSTIN SEMICONDUCTOR INC
|
TOSHIBA CORP
|
Part Package Code |
DIP
|
TSOP1
|
Package Description |
DIP,
|
8 X 20 MM, 0.50 MM PITCH, REVERSE, PLASTIC, TSOP1-32
|
Pin Count |
32
|
32
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.32.00.41
|
|
Access Time-Max |
55 ns
|
100 ns
|
JESD-30 Code |
R-CDIP-T32
|
R-PDSO-G32
|
JESD-609 Code |
e4
|
e0
|
Length |
40.64 mm
|
18.4 mm
|
Memory Density |
1048576 bit
|
2097152 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
|
Number of Terminals |
32
|
32
|
Number of Words |
131072 words
|
262144 words
|
Number of Words Code |
128000
|
256000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
128KX8
|
256KX8
|
Output Characteristics |
3-STATE
|
|
Output Enable |
YES
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
TSOP1-R
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.34 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
15.24 mm
|
8 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 8959826BXC with alternatives
Compare TC55V2001TR-10L with alternatives