8959826BXC vs TC55V2001TR-10L feature comparison

8959826BXC Micross Components

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TC55V2001TR-10L Toshiba America Electronic Components

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer AUSTIN SEMICONDUCTOR INC TOSHIBA CORP
Part Package Code DIP TSOP1
Package Description DIP, 8 X 20 MM, 0.50 MM PITCH, REVERSE, PLASTIC, TSOP1-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 55 ns 100 ns
JESD-30 Code R-CDIP-T32 R-PDSO-G32
JESD-609 Code e4 e0
Length 40.64 mm 18.4 mm
Memory Density 1048576 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 32
Number of Words 131072 words 262144 words
Number of Words Code 128000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 128KX8 256KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP TSOP1-R
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.34 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish PALLADIUM GOLD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.5 mm
Terminal Position DUAL DUAL
Width 15.24 mm 8 mm
Base Number Matches 1 1
Rohs Code No
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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