88E3015-XX-NNP1I000
vs
VSC8552XKS-02
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MARVELL SEMICONDUCTOR INC
|
MICROSEMI CORP
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN,
|
BGA,
|
| Pin Count |
64
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-XQCC-N64
|
S-PBGA-B256
|
| Length |
9 mm
|
17 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
256
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
1.8 mm
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
9 mm
|
17 mm
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
Microsemi Corporation
|
|
|
|
Compare 88E3015-XX-NNP1I000 with alternatives
Compare VSC8552XKS-02 with alternatives