8560VAM2225LHN1110
vs
EETXB2G560HJ
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
FENGHUA ADVANCED TECHNOLOGY
|
PANASONIC CORP
|
| Package Description |
,
|
,
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8532.22.00.40
|
8532.22.00.40
|
| Capacitance |
56 µF
|
56 µF
|
| Capacitor Type |
ALUMINUM ELECTROLYTIC CAPACITOR
|
ALUMINUM ELECTROLYTIC CAPACITOR
|
| Diameter |
22 mm
|
22 mm
|
| Dielectric Material |
ALUMINUM (WET)
|
ALUMINUM (WET)
|
| Length |
25 mm
|
25 mm
|
| Negative Tolerance |
20%
|
20%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Package Style |
Snap-in
|
Snap-in
|
| Packing Method |
Bulk
|
BULK
|
| Polarity |
POLARIZED
|
POLARIZED
|
| Positive Tolerance |
20%
|
20%
|
| Rated (DC) Voltage (URdc) |
400 V
|
400 V
|
| Ripple Current |
420 mA
|
510 mA
|
| Terminal Pitch |
10 mm
|
10 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Leakage Current |
|
0.44901 mA
|
| Manufacturer Series |
|
XB
|
| Mounting Feature |
|
THROUGH HOLE MOUNT
|
| Package Shape |
|
CYLINDRICAL PACKAGE
|
| Series |
|
EET-XB
|
| Surface Mount |
|
NO
|
| Tan Delta |
|
0.15
|
| Terminal Finish |
|
Tin (Sn)
|
| Terminal Shape |
|
SNAP-IN
|
|
|
|
Compare 8560VAM2225LHN1110 with alternatives
Compare EETXB2G560HJ with alternatives