8508701ZA
vs
8508701ZX
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FILM MICROELECTRONICS INC
|
MS KENNEDY CORP
|
Part Package Code |
BCY
|
BCY
|
Package Description |
,
|
,
|
Pin Count |
12
|
12
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Average Bias Current-Max (IIB) |
0.3 µA
|
0.3 µA
|
Common-mode Reject Ratio-Nom |
70 dB
|
70 dB
|
Input Offset Voltage-Max |
3000 µV
|
3000 µV
|
JESD-30 Code |
O-MBCY-W12
|
O-MBCY-W12
|
JESD-609 Code |
e0
|
|
Neg Supply Voltage Limit-Max |
-18 V
|
-18 V
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Functions |
1
|
1
|
Number of Terminals |
12
|
12
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
METAL
|
METAL
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
CYLINDRICAL
|
CYLINDRICAL
|
Qualification Status |
Not Qualified
|
Qualified
|
Screening Level |
MIL-STD-883
|
|
Slew Rate-Nom |
3 V/us
|
|
Supply Voltage Limit-Max |
18 V
|
18 V
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
NO
|
NO
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb) - hot dipped
|
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 8508701ZA with alternatives
Compare 8508701ZX with alternatives