8407501EA
vs
MC74HC161N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP-16
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Additional Feature
RCO OUTPUT
Count Direction
UP
UP
Family
HC/UH
JESD-30 Code
R-GDIP-T16
R-PDIP-T16
Length
19.56 mm
Load/Preset Input
YES
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Mode of Operation
SYNCHRONOUS
SYNCHRONOUS
Moisture Sensitivity Level
NOT APPLICABLE
Number of Bits
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Propagation Delay (tpd)
310 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Trigger Type
POSITIVE EDGE
Width
7.62 mm
fmax-Min
25 MHz
Base Number Matches
7
3
Rohs Code
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
62000000 Hz
Max I(ol)
0.004 A
Package Equivalence Code
DIP16,.3
Power Supplies
2/6 V
Terminal Finish
Tin/Lead (Sn/Pb)
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