82P2284BBG
vs
82P2284BBG8
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
PBGA
|
|
| Package Description |
GREEN, PLASTIC, BGA-208
|
GREEN, PLASTIC, BGA-208
|
| Pin Count |
208
|
|
| Manufacturer Package Code |
BBG208
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Carrier Type |
T-1(DS1)
|
T-1(DS1)
|
| Carrier Type (2) |
T-1(DS1)
|
T-1(DS1)
|
| JESD-30 Code |
S-PBGA-B208
|
S-PBGA-B208
|
| JESD-609 Code |
e1
|
e1
|
| Length |
17 mm
|
17 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
208
|
208
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA208,16X16,40
|
BGA208,16X16,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.97 mm
|
1.97 mm
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Telecom IC Type |
PCM TRANSCEIVER
|
PCM TRANSCEIVER
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
17 mm
|
17 mm
|
| Base Number Matches |
4
|
1
|
| Factory Lead Time |
|
26 Weeks, 1 Day
|
| Samacsys Manufacturer |
|
Renesas Electronics
|
|
|
|
Compare 82P2284BBG with alternatives
Compare 82P2284BBG8 with alternatives