8202103YX
vs
5962-8946203MYA
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
,
|
DIP, DIP64,.9
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Technology |
CMOS
|
CMOS
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
6
|
6
|
| Rohs Code |
|
No
|
| Bit Size |
|
32
|
| JESD-30 Code |
|
R-XDIP-T64
|
| JESD-609 Code |
|
e0
|
| Number of Terminals |
|
64
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
CERAMIC
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP64,.9
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Power Supplies |
|
5 V
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Speed |
|
12.5 MHz
|
| Supply Current-Max |
|
45 mA
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
NO
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
|
|
|
Compare 8202103YX with alternatives