8202103YX
vs
TS68C000DESC03YAA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
THALES COMPONENTS CORP
|
ATMEL CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
CERAMIC, DIP-64
|
DIP,
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
23
|
24
|
| Bit Size |
16
|
32
|
| Clock Frequency-Max |
10 MHz
|
12.5 MHz
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
R-CDIP-T64
|
R-CDIP-T64
|
| Number of Terminals |
64
|
64
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
10 MHz
|
12.5 MHz
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
HCMOS
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
6
|
3
|
| ECCN Code |
|
3A001.A.2.C
|
| Boundary Scan |
|
NO
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| Length |
|
81.28 mm
|
| Low Power Mode |
|
NO
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Seated Height-Max |
|
4.83 mm
|
| Temperature Grade |
|
MILITARY
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
22.86 mm
|
|
|
|
Compare 8202103YX with alternatives
Compare TS68C000DESC03YAA with alternatives