MC68HC000IR12F vs MC68HC000R12F feature comparison

MC68HC000IR12F Motorola Mobility LLC

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MC68HC000R12F Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description DIP, PGA, PGA68,10X10
Pin Count 64
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01
Address Bus Width 23
Bit Size 32 32
Boundary Scan NO
Clock Frequency-Max 16.67 MHz
External Data Bus Width 16
Format FIXED POINT
Integrated Cache NO
JESD-30 Code R-PDIP-T64 S-XPGA-P68
Length 81.535 mm
Low Power Mode NO
Number of DMA Channels
Number of External Interrupts 7
Number of Serial I/Os
Number of Terminals 64 68
On Chip Data RAM Width
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code DIP PGA
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE GRID ARRAY
Qualification Status Not Qualified Not Qualified
RAM (words) 0
Seated Height-Max 5.84 mm
Speed 16.67 MHz 16.67 MHz
Supply Current-Max 50 mA
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Form THROUGH-HOLE PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL PERPENDICULAR
Width 22.86 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 3
Rohs Code No
JESD-609 Code e0
Package Equivalence Code PGA68,10X10
Power Supplies 5 V
Terminal Finish Tin/Lead (Sn/Pb)

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