MC68HC000IR12F
vs
MC68HC000R12F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP,
PGA, PGA68,10X10
Pin Count
64
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
Address Bus Width
23
Bit Size
32
32
Boundary Scan
NO
Clock Frequency-Max
16.67 MHz
External Data Bus Width
16
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
R-PDIP-T64
S-XPGA-P68
Length
81.535 mm
Low Power Mode
NO
Number of DMA Channels
Number of External Interrupts
7
Number of Serial I/Os
Number of Terminals
64
68
On Chip Data RAM Width
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
PGA
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
5.84 mm
Speed
16.67 MHz
16.67 MHz
Supply Current-Max
50 mA
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Form
THROUGH-HOLE
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
PERPENDICULAR
Width
22.86 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
2
3
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
PGA68,10X10
Power Supplies
5 V
Terminal Finish
Tin/Lead (Sn/Pb)
Compare MC68HC000IR12F with alternatives