MC68HC000IR12F
vs
MC68HC000R12F
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Part Package Code |
DIP
|
|
Package Description |
DIP,
|
PGA, PGA68,10X10
|
Pin Count |
64
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
|
Address Bus Width |
23
|
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
|
Clock Frequency-Max |
16.67 MHz
|
|
External Data Bus Width |
16
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
R-PDIP-T64
|
S-XPGA-P68
|
Length |
81.535 mm
|
|
Low Power Mode |
NO
|
|
Number of DMA Channels |
|
|
Number of External Interrupts |
7
|
|
Number of Serial I/Os |
|
|
Number of Terminals |
64
|
68
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
Package Code |
DIP
|
PGA
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
|
Seated Height-Max |
5.84 mm
|
|
Speed |
16.67 MHz
|
16.67 MHz
|
Supply Current-Max |
50 mA
|
|
Supply Voltage-Max |
5.25 V
|
|
Supply Voltage-Min |
4.75 V
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
PIN/PEG
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
PERPENDICULAR
|
Width |
22.86 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
3
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
PGA68,10X10
|
Power Supplies |
|
5 V
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare MC68HC000IR12F with alternatives