Findchips: Compare 8200901JA vs CY7C264-25DC

8200901JA vs CY7C264-25DC feature comparison

Buy Now

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	FAIRCHILD SEMICONDUCTOR CORP	CYPRESS SEMICONDUCTOR CORP
Part Package Code	DIP	DIP
Package Description	DIP,	0.600 INCH, CERDIP-24
Pin Count	24	24
Reach Compliance Code	unknown	not_compliant
ECCN Code	EAR99	EAR99
HTS Code	8542.32.00.71	8542.32.00.71
Access Time-Max	45 ns	25 ns
JESD-30 Code	R-GDIP-T24	R-GDIP-T24
Memory Density	65536 bit	65536 bit
Memory IC Type	OTP ROM	OTP ROM
Memory Width	8	8
Number of Functions	1	1
Number of Terminals	24	24
Number of Words	8192 words	8192 words
Number of Words Code	8000	8000
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	125 °C	70 °C
Operating Temperature-Min	-55 °C
Organization	8KX8	8KX8
Package Body Material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
Package Code	DIP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Qualification Status	Not Qualified	Not Qualified
Screening Level	MIL-STD-883
Supply Current-Max	0.19 mA	0.12 mA
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	BIPOLAR	CMOS
Temperature Grade	MILITARY	COMMERCIAL
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Position	DUAL	DUAL
Base Number Matches	1	1
Rohs Code		No
Additional Feature		POWER SWITCHED PROM
I/O Type		COMMON
JESD-609 Code		e0
Length		31.877 mm
Output Characteristics		3-STATE
Package Equivalence Code		DIP24,.6
Seated Height-Max		5.715 mm
Standby Current-Max		0.04 A
Terminal Finish		Tin/Lead (Sn/Pb)
Terminal Pitch		2.54 mm
Width		15.24 mm
	Memory » OTP ROMs	Memory » OTP ROMs