8200901JA
vs
93Z564DMQB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP,
CERAMIC, DIP-24
Pin Count
24
24
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
40 ns
60 ns
JESD-30 Code
R-GDIP-T24
R-CDIP-T24
Memory Density
65536 bit
2048 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
4
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
512X4
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Screening Level
MIL-STD-883
38535Q/M;38534H;883B
Supply Current-Max
0.19 mA
0.05 mA
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
6
1
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP24,.6
Qualification Status
Not Qualified
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Compare 8200901JA with alternatives
Compare 93Z564DMQB with alternatives