8200507YA
vs
MSM2764A-12AS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SEEQ TECHNOLOGY INC
LAPIS SEMICONDUCTOR CO LTD
Package Description
DIP, DIP28,.6
DIP, DIP28,.6
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
200 ns
120 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T28
R-XDIP-T28
Memory Density
65536 bit
65536 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
8KX8
8KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
21 V
12.5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Supply Current-Max
0.1 mA
0.1 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
MOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
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