8001209JX vs AM2732B-250DI feature comparison

8001209JX AMD

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AM2732B-250DI AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, WDIP, DIP24,.6
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
JESD-30 Code R-XDIP-T24 R-GDIP-T24
Memory Density 32768 bit 32768 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 4KX8 4KX8
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Current-Max 0.1 mA 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS NMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Length 32.0675 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP24,.6
Programming Voltage 12.5 V
Seated Height-Max 5.588 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare 8001209JX with alternatives

Compare AM2732B-250DI with alternatives