7SB384DTT1G
vs
PI5C3301C
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
PERICOM SEMICONDUCTOR CORP
|
| Part Package Code |
TSOP
|
SOIC
|
| Package Description |
LEAD FREE, TSOP-5
|
TSSOP,
|
| Pin Count |
5
|
5
|
| Manufacturer Package Code |
483
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
2 Days
|
|
| Family |
CBT/FST/QS/5C/B
|
CBT/FST/QS/5C/B
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| JESD-609 Code |
e3
|
|
| Length |
3 mm
|
2 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Polarity |
INVERTED
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
1.5 mm
|
1.25 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Output Characteristics |
|
3-STATE
|
| Technology |
|
CMOS
|
|
|
|
Compare 7SB384DTT1G with alternatives
Compare PI5C3301C with alternatives