79RV308120MJM
vs
79RV3081E20MJM
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFN
QFN
Package Description
QCCJ,
QCCJ, LDCC84,1.2SQ
Pin Count
84
84
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
50 MHz
50 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PQCC-J84
S-PQCC-J84
JESD-609 Code
e0
e0
Length
29.083 mm
29.083 mm
Low Power Mode
YES
YES
Number of Terminals
84
84
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
4.572 mm
Speed
20 MHz
20 MHz
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn85Pb15)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
29.083 mm
29.083 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Moisture Sensitivity Level
1
Package Equivalence Code
LDCC84,1.2SQ
Peak Reflow Temperature (Cel)
225
Supply Current-Max
375 mA
Time@Peak Reflow Temperature-Max (s)
30
Compare 79RV308120MJM with alternatives
Compare 79RV3081E20MJM with alternatives