79RC64V474200DZG
vs
IDT79RC64V474-200DZ9
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFP-128
|
QFP,
|
| Pin Count |
128
|
128
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
64
|
64
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
100 MHz
|
100 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PQFP-G128
|
S-PQFP-G128
|
| JESD-609 Code |
e3
|
e0
|
| Length |
28 mm
|
28 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
128
|
128
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
4.1 mm
|
| Speed |
200 MHz
|
200 MHz
|
| Supply Voltage-Max |
3.465 V
|
3.63 V
|
| Supply Voltage-Min |
3.135 V
|
2.97 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
28 mm
|
28 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
3
|
|
|
|
Compare 79RC64V474200DZG with alternatives
Compare IDT79RC64V474-200DZ9 with alternatives