79RC32V334150BBGI vs IBM25PPC750CXRKQ4024T feature comparison

79RC32V334150BBGI Integrated Device Technology Inc

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IBM25PPC750CXRKQ4024T IBM

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC IBM MICROELECTRONICS
Part Package Code BGA BGA
Package Description BGA, BGA256,16X16,40 LBGA, BGA256,20X20,50
Pin Count 256 256
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 75.02 MHz 133 MHz
External Data Bus Width 32 64
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1
Length 17 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 1.666 mm
Speed 150 MHz 466 MHz
Supply Current-Max 700 mA
Supply Voltage-Max 3.465 V 1.9 V
Supply Voltage-Min 3.135 V 1.8 V
Supply Voltage-Nom 3.3 V 1.85 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 17 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1

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