IBM25PPC750CXRKQ4024T vs MCF54415CMJ250 feature comparison

IBM25PPC750CXRKQ4024T IBM

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MCF54415CMJ250 Freescale Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer IBM MICROELECTRONICS FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description LBGA, BGA256,20X20,50 12 X 12 MM, ROHS COMPLIANT, MAPBGA-256
Pin Count 256 256
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 100 MHz
External Data Bus Width 64
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA256,20X20,50 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.666 mm
Speed 466 MHz 250 MHz
Supply Voltage-Max 1.9 V 1.32 V
Supply Voltage-Min 1.8 V 1.14 V
Supply Voltage-Nom 1.85 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 1 2
Pbfree Code Yes
Samacsys Manufacturer NXP
JESD-609 Code e2
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Temperature Grade INDUSTRIAL
Time@Peak Reflow Temperature-Max (s) 40

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Compare MCF54415CMJ250 with alternatives