79RC32V334-133BBI
vs
79RC32V334-133BB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, PLASTIC, BGA-256
27 X 27 MM, PLASTIC, BGA-256
Pin Count
256
256
Reach Compliance Code
not_compliant
not_compliant
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.67 MHz
66.67 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e0
Length
17 mm
17 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
256
256
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Power Supplies
3.3 V
3.3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Speed
133 MHz
133 MHz
Supply Current-Max
630 mA
630 mA
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
20
Width
17 mm
17 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Compare 79RC32V334-133BBI with alternatives
Compare 79RC32V334-133BB with alternatives