79RC32V334-133BBI vs XPC850CZT50BUR2 feature comparison

79RC32V334-133BBI Integrated Device Technology Inc

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XPC850CZT50BUR2 Motorola Semiconductor Products

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No
Obsolete Transferred
INTEGRATED DEVICE TECHNOLOGY INC MOTOROLA INC
BGA
27 X 27 MM, PLASTIC, BGA-256 PLASTIC, BGA-256
256
not_compliant unknown
32 26
32 32
YES YES
66.67 MHz 50 MHz
32 32
FIXED POINT FIXED POINT
YES YES
S-PBGA-B256 S-PBGA-B256
e0
17 mm 23 mm
YES YES
3
256 256
85 °C
-40 °C
PLASTIC/EPOXY PLASTIC/EPOXY
BGA BGA
BGA256,16X16,40
SQUARE SQUARE
GRID ARRAY GRID ARRAY
225
3.3 V
Not Qualified Not Qualified
3.5 mm 2.35 mm
133 MHz 50 MHz
630 mA
3.465 V 3.465 V
3.135 V 3.135 V
3.3 V 3.3 V
YES YES
INDUSTRIAL
Tin/Lead (Sn63Pb37)
BALL BALL
1 mm 1.27 mm
BOTTOM BOTTOM
20
17 mm 23 mm
MICROPROCESSOR, RISC MICROPROCESSOR, RISC
1 3
3A991.A.2
8542.31.00.01
CMOS

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